The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 1997
Filed:
Aug. 08, 1994
Mathias Eichhorn, Niedernhausen, DE;
Gerhard Buhr, Koenigstein, DE;
Hoechst Aktiengesellschaft, Frankfurt am Main, DE;
Abstract
The invention relates to N,N-disubstituted sulfonamides of the formulae R.sup.1 [--N(CO--OR.sup.2)--SO.sub.2 --R.sup.3 ].sub.n (I) and R.sup.1 [--SO.sub.2 --N(CO--OR.sup.2)--R.sup.3 ].sub.n (II), in which R.sup.1 --for n=1--is a (C.sub.1 -C.sub.20)alkyl, (C.sub.3 -C.sub.10)cycloalkyl, (C.sub.6 -C.sub.14) aryl or (C.sub.7 -C.sub.20)aralkyl radial, for n>1--the 2-, 3- or 4-valent radical of a (C.sub.1 -C.sub.20)alkane or (C.sub.6 -C.sub.7)cycloalkane, a non-condensed or condensed mono- or polynuclear (C.sub.6 -C.sub.18)aromatic compound, R.sup.2 is a (C.sub.3 -C.sub.11)alkyl, (C.sub.3 -C.sub.11)alkenyl or (C.sub.7 -C.sub.11)aralkyl radical, R.sup.3 is an unsubstituted or substituted (C.sub.1 -C.sub.6)alkyl, (C.sub.3 -C.sub.6)cycloalkyl, (C.sub.6 -C.sub.14)aryl or (C.sub.7 -C.sub.20)aralkyl radical. The invention further relates to a positive radiation-sensitive mixture containing a) a compound which under the influence of actinic radiation forms acid, b) an acid-cleavable compound whose cleavage products in an aqueous alkaline developer have a higher solubility than the starting compound, and c) a polymeric binder which is insoluble in water but is soluble or at least swellable in aqueous alkaline solutions, in which the compound b) is a sulfonamide of the formula I or II. The mixture according to the invention is particularly suitable for the manufacture of offset printing plates and photoresists.