The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 1997
Filed:
May. 25, 1994
Raymond A Frechette, North Providence, RI (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
This invention relates to lead frames upon which chips are mounted prior to encapsulation. A lead frame structure (6) for manufacturing an IC device comprises a lead frame base (1) including a plurality of leads (10) and four first tie bar portions (16) extending toward a die pad aperture (17). A die pad (2) forms a mounting surface (20) for receiving a chip (30) and includes four second tie bar portions (21) extending from the mounting surface (20) and corresponding to the four first tie bar portions (16). The die pad (2) is affixed to the lead frame base (1) and positioned in the aperture (17) by affixing each of the second tie bar portions (21) to a corresponding one of the first tie bar portions (16).