The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 1997
Filed:
Sep. 15, 1994
Toyoki Kawahara, Kawasaki, JP;
Atsuharu Yamamoto, Kawasaki, JP;
Yuji Maruyama, Tokyo, JP;
Hidehiko Kawakami, Tokyo, JP;
Hideaki Kawamura, Kyoto, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
Pieces of feature information in a bi-level image such as a width, a branching point and an ending point of a wiring pattern are detected in a design rule checking section according to a micro inspection to find out pieces of feature information departing from a design rule. Also, feature codes in the bi-level image such as a corner of the wiring pattern are detected in a specific shape detecting section according to a macro inspection. The feature information are compared with pieces of referential feature information pertaining to a non-defective wiring pattern in a first comparing and judging section to judge whether the wiring pattern indicated by the feature information is defective or non-defective. The feature codes are compared with referential feature codes pertaining to a non-defective wiring pattern in a second comparing and judging section to judge whether the wiring pattern indicated by the feature codes is defective or non-defective. Therefore, defective types and portions of the wiring pattern can be detected by performing the macro inspection and the micro inspection in parallel without dividing the wiring pattern into processed regions.