The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 1997
Filed:
Feb. 06, 1995
Alexander C Tain, Milpitas, CA (US);
Georg Kuhnke, San Jose, CA (US);
Kris Shih-Yen Chou, San Jose, CA (US);
Advanced Micro Devices, Sunnyvale, CA (US);
Abstract
A system and method which includes a user interface for automation of the build sheet is provided. The database icon or command of the user interface is executed to select an appropriate package for an IC chip, and a blank bond master is downloaded to the hard disk of the work station. The engineer can choose either the suggest die icon/command or the die cleaner icon/command to create an image file of the die pad ring based on a mask layer best representative of the die pad ring. Thereafter, the die pads and bond fingers are identified and a net list is complied when the wire bonding icon or command is executed to create a bonding device diagram without the die image. A die image is created based on a mask layer best representative of the die using either the TIF to AutoCAD icon/command or the GDS to AutoCAD icon/command. The Die Image Merge icon/command merges the die image with the bonding device diagram to complete the build sheet. Thereafter, an IC package may be fabricated based on the bonding device diagram.