The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 1997
Filed:
Jun. 22, 1995
Yukihiro Tsuji, Kumamoto, JP;
NEC Corporation, Tokyo, JP;
Abstract
Disclosed is a resin-sealed semiconductor device which has an insulation substrate 1 having a chip-mounting portion is, leads which are radially disposed around the chip-mounting portion, an IC chip mounted on the chip-mounting portion and connected electrically with inner portions of the leads, a resin which seals over an area which includes the IC chip and the inner leads and does not include a peripheral portion of the insulation substrate and the outer leads, and outer portion of terminals which are electrically connected with the outer leads which are left out of the resin.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile