The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 1997

Filed:

Apr. 25, 1995
Applicant:
Inventors:

Masaharu Yoshida, Fukuoka, JP;

Masataka Takehara, Fukuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257 99 ; 257 98 ; 257431 ; 257432 ; 257433 ;
Abstract

In order to position an optical semiconductor element in high accuracy and to readily fabricate the same, step is formed on an upper surface of a forward end of an electrode (123) projecting from a lead frame. A submount (102) is previously soldered to a lower stage surface (125), while solder (172) is applied to its upper surface. A collet (61) which is softly supported by a spring (63) in the vertical direction suctionally holds a laser diode element (101) and approaches the electrode (123) from above, to be stopped when its leg portion (61b) comes into contact with an upper stage surface (126). Thus, the laser diode element (101) is precisely positioned. In this state, the solder (172) is heated and cooled, to solder the laser diode element (101) to the submount (102). The laser diode element (101) molded with transparent resin, to be easy to fabricate.


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