The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 1997
Filed:
Jun. 06, 1995
Yasuichi Ono, Furukawa, JP;
Akihiro Makino, Nagaoka, JP;
Akihisa Inoue, Aoba-ku, Sendai-shi, Miyagi-ken, JP;
Tsuyoshi Masumoto, Sendai-shi, Miyagi-ken, JP;
Yoshio Harakawa, Okaya, JP;
Abstract
Alloy powder which is low in price and is unlikely to be oxidized on the surface, and a dispersion-type conductor using the alloy powder in which electromigration is not likely to occur. Melt of copper and silver is cooled at a high cooling speed of 10.sup.5 .degree.C./s or higher. Alloy powder having a composition expressed by a chemical formula Cu.sub.x Ag.sub.1-x (where 0.80.ltoreq..times..ltoreq.0.99) is obtained. Also, a dispersion-type conductor is produced by dispersing 100 parts by weight of the alloy powder in between 5-100 parts by weight of a binder. Thus, the low-priced alloy powder and the dispersion-type conductor of high quality and high reliability can be obtained.