The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 1997
Filed:
Jun. 30, 1994
Applicant:
Inventors:
William R Hamburgen, Palo Alto, CA (US);
John S Fitch, Newark, CA (US);
Yezdi N Dordi, Cambridge, MA (US);
Assignee:
Digital Equipment Corporation, Maynard, MA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257676 ; 257712 ; 257713 ; 257787 ; 257796 ;
Abstract
Disclosed is a semiconductor package and method in which a semiconductor chip is mounted within the opening of a lead frame by bonding wires extending between the active front side of the chip and bonding pads of the lead frame, and the lead frame/chip assembly is encased. within a plastic molded body, with the inactive back side of the chip exposed and facing outside the package.