The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 1997
Filed:
Sep. 05, 1995
Motomi Ichihashi, Itami, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A less expensive small semiconductor pressure sensor in which a pressure sensing element is not displaced by vibration and the like and wire bonding is highly reliably effected includes a pressure sensing element having a diaphragm and a glass base die bonded to a die pad in substantially the same plane as that of an outer lead with a bonding resin. Each of two sets of hanging leads is attached to one of two opposite sides of the die pad to fix the die pad to a package base. With this arrangement, the die pad is securely bonded to the package base to prevent breakage of a metal wire caused by vibration and the like so that a less expensive and smaller semiconductor pressure sensor can be provided.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile