The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 1997
Filed:
Jan. 31, 1995
Kuo-Hsin Li, Irvine, CA (US);
Hughes Aircraft Company, Los Angeles, CA (US);
Abstract
A mounting and protective package for a monolithic microwave integrated circuit die (16) operable in the K.sub.a -band is formed of two high temperature co-fired ceramic layers sandwiched by two metal layers (10,12,20,26) that minimize hermetic sealing problems. The package has high frequency input/output lines (40,42), each including a section defining a microstrip line (40a,41a), a section defining a shielded strip line (40b,41b), and a section defining a capacitor (40c, 41c) . The capacitor is precisely defined to provide optimum input/output transmission line impedance that minimizes loss. The integrated circuit die (16) is mounted within a recess (14,46) in the package and is wire bonded (22,24) to input and output capacitors (40c,41c) that in turn are connected with shielded strip lines (40b,41b) and microstrip lines (40a,41a) for both input and output. An unique configuration and location of conductive material filled vias (48a-48l, 63a-63l) interconnect a metallized base and a metallized lid of the package to define a resonant cavity that eliminate resonant or moding problems from 26-36 GHz operation.