The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 1997
Filed:
Dec. 20, 1994
Kimiwaka Ooizumi, Sayama, JP;
Kouichi Tanaka, Higashiyamato, JP;
Enya Systems Limited, , JP;
Abstract
A method and apparatus are provided for applying a wafer to a mount plate. A wafer having a lower surface coated with an adhesive layer is held by a vacuum chuck through suction. A vacuum-tight sealing enclosure is placed over the wafer and a mount plate to define a sealed space. The sealed space is then evacuated at a degree of vacuum higher than the degree of vacuum of the vacuum chuck to effect release of the wafer from the vacuum chuck and dropping of the wafer onto the mount plate. The wafer is applied to the mount plate without the occlusion of air bubbles between the wafer and the mount plate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile