The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 1997

Filed:

Apr. 06, 1995
Applicant:
Inventors:

Jan A Paasonen, Kerava, FI;

Seppo A Ylisel a, J arvenp aa, FI;

Assignee:

Stowe Woodward Licensco, Inc., Wilmington, DE (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
428375 ; 428 68 ; 428 71 ; 428 76 ; 428155 ; 428372 ; 428377 ; 428382 ; 428383 ; 428390 ; 4284258 ; 428461 ; 427195 ; 427318 ; 427358 ; 264 469 ; 264225 ;
Abstract

The problems caused by chemical and thermal shrinkage of hard roll covers, are reduced by the inclusion of one or more intermediate compressive layers between the metal roll and the outer cover, or 'topstock'. A compressive layer has the properties of being rigid enough to allow the cover to be applied to the roll, and compressible enough to buffer and absorb the stresses which occur as the cover is shrinking during processing. In one embodiment, the intermediate compressive layer comprises a three dimensional fabric that is filled preferably with a thermoset resin system which cures at lower temperature than cover. In a second embodiment, the precise amount of shrinkage in the roll can be predetermined to a high enough degree of accuracy so that a depth for the fabric layer can be used to compensate for the amount of shrinkage, thereby eliminating the need for filling. In a third embodiment, the compressive layer is comprised of a wax material. The problems caused by chemical and thermal shrinkage are further reduced through a method based on applying a polymeric cover layer over one or more intermediate compressive layers, curing at an elevated temperature, and, allowing the cover to shrink during curing or hardening.


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