The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 1997
Filed:
Nov. 27, 1995
Siniti Nakazato, Fukuoka, JP;
Teruaki Kasai, Fukuoka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
In a solder ball attaching apparatus, a pickup head is lowered and raised just above a solder ball feed section so as to pick up a large number of solder balls. The pickup head then moves to a position just above a flux feed section where the pickup head is lowered and raised so as to flux the solder balls. Further, the pickup head moves to a position just above a workpiece where the pickup head is lowered and raised so as to attach the solder balls onto electrodes of the workpiece. Alongside a transfer path of the pickup head are arranged first and second line light sources, a light-emitting element and a light-receiving element for monitoring presence or absence of a solder ball pickup error, dislodging of the solder ball and a solder ball attaching error.