The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 1997

Filed:

Jan. 11, 1995
Applicant:
Inventors:

Yoshitomo Kanazawa, Tokyo, JP;

Toshiyuki Nanaarashi, Tokyo, JP;

Toshiki Miyazawa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B21D / ;
U.S. Cl.
CPC ...
72352 ; 723532 ; 723554 ; 72356 ;
Abstract

An object of the present invention is to provide a die set, which is capable of removing the influence of heat expansion and the change of the number of the collared holes and improving the accuracy of the collar height. In a die set including an upper die and a lower die wherein a metal plate having a collared hole is provided between the dies to form a flange section at an end of the collar, a flare-punch is provided to the upper die and is capable of vertically moving therein. The flare-punch has a flange forming section for forming the flange section. A biasing member biases the flare-punch toward the lower die. A level pin for defining a lower dead point of the flare-pin is provided to the lower die. The level pin is capable of coming into contact with the flare-punch, which has been in the collar, when the upper die and the lower die are closed.


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