The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 1997

Filed:

Jun. 27, 1995
Applicant:
Inventors:

Ashwinkumar C Bhatt, Endicott, NY (US);

Thomas P Duffy, Endicott, NY (US);

David E Houser, Apalachin, NY (US);

Gerald W Jones, Apalachin, NY (US);

Jeffrey McKeveny, Endicott, NY (US);

Kenneth L Potter, Kirkwood, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437209 ; 437211 ; 437214 ; 437217 ; 437219 ;
Abstract

A method of making a circuitized substrate which may be utilized as a chip carrier structure. The method involves the steps of providing a dielectric member and partially routing this member to define a temporary support portion therein. Metallization and circuitization may then occur, following which the temporary support portion is removed. This temporary support thus assures effective support for the photoresist used as part of the circuitization process. Thus, the photoresist is capable of being applied in sheetlike form for spanning the relatively small openings of the dielectric without sagging, bowing, etc., which may adversely impact subsequent processing steps.


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