Automatic stamper exchange device and injection molding apparatus

Abstract

An automatic stamper exchange device for effecting automatic stamper exchange to and from a mold of an injection molding apparatus includes a first stamper housing unit, a second housing unit, a stamper mounting and dismounting unit and a stamper supplying unit. A used-up stamper is housed in the first stamper housing unit, and a new stamper is housed in the second housing unit. The stamper mounting and dismounting unit dismounts the new stamper from the metal mold or mounts the used-up stamper on the metal mold. The stamper supplying unit houses the used-up stamper dismounted by the stamper mounting and dismounting unit in the first stamper housing unit or takes out the new stamper housed in the second stamper housing unit to supply it to the stamper mounting and dismounting unit. The automatic stamper exchange device operates in such a manner that, after the end of the injection molding operation by the metal mold, the used-up stamper is dismounted from the metal mold by the stamper mounting and dismounting unit so as to be housed in the first housing unit, and the new stamper is taken out by the stamper supplying unit from the second housing unit so as to be mounted on the metal mold by the stamper mounting and dismounting unit.