The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 1997

Filed:

Apr. 26, 1995
Applicant:
Inventors:

Yasushi Ito, Itami, JP;

Takehisa Yamamoto, Itami, JP;

Takao Nishioka, Itami, JP;

Akira Yamakawa, Itami, JP;

Osamu Komura, Itami, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
264234 ; 264 60 ; 264235 ; 264345 ; 264346 ;
Abstract

A method of producing a silicon nitride ceramic component, comprising: grinding a silicon nitride sintered body comprising .alpha.--Si.sub.3 N.sub.4 having an average grain size of 0.5 .mu.m or smaller and .beta.'-sialon having an average grain size of 3 .mu.m or smaller in major axis and 1 .mu.m or smaller in minor axis into a predetermined size with a surface roughness of 1-7 .mu.m in ten-point mean roughness; heat treating the same at temperature range of 800.degree.-1200.degree. C. in the air; and standing it to allow to be cooled, whereby providing a residual stress in the ground surface before and after the heat treating as a residual compressive stress at a ratio of 1 or higher of the residual compressive stress after the heat treating to that before the heat treating (residual compressive stress after the heat treating/residual compressive stress before the heat treating), preferably 5 or more.


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