The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 1997

Filed:

Jan. 04, 1993
Applicant:
Inventors:

Arun Prasad, Cheshire, CT (US);

Michael Weston, Danville, NY (US);

Grant Bauer, Point Pleasant, NJ (US);

Assignee:

Gemetals Corporation, Danville, NH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C / ; C22C / ;
U.S. Cl.
CPC ...
148436 ; 420489 ;
Abstract

A copper-aluminum-indium alloy approaches gold in spectral appearance, tarnish resistance and mechanical durability, by virtue of a specific formulation and microstructure. The formulation consists of the following essential ingredients by total weight, in a copper matrix: from 7 to 12% of aluminum, from 5 to 11% of indium, and no more than 3% of a essentially non-ferromagnetic remainder. The required microstructure is in the form an essentially ternary alloy having a quenched single phase, an average grain size of no more than 100 .mu.m in diameter. Preferably, the above specified 3% remainder includes: a modifier selected from the class consisting of boron, silicon, lithium, magnesium, zinc and phosphorous; a strengthener selected from the class consisting of silver, gold, palladium, platinum, iridium, ruthenium and rhodium; and a system stabilizer, preferably selected from the class consisting of yttrium, cerium, lanthanum, hafnium, zirconium, chromium, titanium, nickel, iron and manganese.


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