The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 1997
Filed:
Jul. 27, 1994
George A Pavlath, Thousand Oaks, CA (US);
Ronald J Michal, Wrightwood, CA (US);
Ralph A Patterson, Canoga Park, CA (US);
Sidney X Huang, West Hills, CA (US);
Litton Systems, Inc., Woodland Hills, CA (US);
Abstract
A fiber optic sensing coil formed in a polarization-maintaining optical fiber has two optical fiber leads extending therefrom. A multifunction integrated optics chip linearly polarizes optical signals input to the sensing coil. Fiber optic leads formed of polarization-maintaining optical fiber extend from the multifunction integrated optics chip. The fiber optic multifunction integrated optics chip leads are arranged such that the linear polarization of optical signals output from the multifunction integrated optics chip is directed along one of the principal axes of birefringence of each of the fiber optic multifunction integrated optics chip leads. Splices are formed between corresponding the first sensing coil leads and the multifunction integrated optics chip leads. The sensing coil leads and the multifunction integrated optics chip leads are arranged such that their corresponding principal axes of birefringence are at angles of approximately 45.degree. relative to one another. The first splice is formed a distance from the multifunction integrated optics chip such that a selected phase change between polarization components occurs in optical waves that propagate the distance L.sub.1 in the first multifunction integrated optics chip lead.