The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 1997

Filed:

May. 12, 1995
Applicant:
Inventors:

Daniel T Courtney, Palmyra, NY (US);

Kenneth W Hermann, Rochester, NY (US);

Stanley R Miska, Pittsford, NY (US);

Assignee:

Schlegel Corporation, Rochester, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
174 / ; 174 / ;
Abstract

An electronic device is shielded against electromagnetic interference using a flexible conductive sheet forming a shield barrier or enclosure. The sheet has electrically insulating polymer material exposed on the surface of at least one face. Conductive material is embedded in or laminated on the sheet so as to be exposed selectively. More particularly, a nonconductive surface area is formed, especially oriented inwardly to avoid electrical shorts, but also exposed inwardly or outwardly where necessary to ground the shield barrier or to engage with another conductive body. The flexible sheet can form a loose envelope with a flange-like gasket at an open end. The gasket can be used to improve physical contact with a conductive body, and preferably also admits I/O connectors that need to traverse the shield barrier, and advantageously have external shielding that is grounded to the shielding barrier for continuing the shielding enclosure. Alternatively or additionally, openings are provided in the sheet for access, the conductive material being insulated around a perimeter or the openings by insulating lips which prevent unwanted shorting. This permits changing or adding circuit chips without removing the shield, and can be provided with a flap closure for minimizing the gap in the shield. The flexible envelope can be joined to a circuit ground by clamping the gasket or the conductive fibers on an exposed face to a the I/O connector, to a common ground, or to an external grounded panel.


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