The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 1997
Filed:
Feb. 12, 1993
Asahi Kasei Kogyo Kabushiki Kaisha, Osaka, JP;
Abstract
The present invention relates to a novel composite material, that is, a prepreg, obtained by bonding a film (1) comprised of an organic polymer having substantially no melting point and having a high modulus of 700 kg/mm.sup.2 or more and a high strength of 35 kg/mm.sup.2 or more and a resin layer (2) and/or fiber-reinforced layer (3), a composite molded body, a method of manufacturing a composite molded body. The composite molded body obtained by bonding the film (1) and the resin layer (2) of the present invention has superior strength, excellent pliability, and large toughness in all directions. Further, the composite molded body obtained by bonding the film (1) and the fiber-reinforced resin layer (3) has both an extremely large impact resistance which could never be obtained with conventional molded bodies and also a strength and modulus greater than in the past. The molded body can be suitably used for aerospace equipment, sports goods, leisure goods, etc. making use of its light weight, corrosion resistance, and other properties in addition to the, above superior properties.