The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 1997
Filed:
Feb. 24, 1995
Nippondenso Co., Ltd., Kariya, JP;
Abstract
A liquid-sealed type semiconductor pressure sensor with no filling orifice includes a connector housing which is made of high polymer compound material of high air permeability and which has a recess and connector pins, where a main housing which has a sealing diaphragm is secured to the connector housing airtightly and a pressure sensitive element is disposed in the recess and is electrically connected to external circuitry by connector pins. A pressure detecting chamber formed between the recess and the sealing diaphragm is filled with pressure transmitting medium, such as silicone oil, having high air solubility. To manufacture the sensor, the recess is filled with a fixed volume of the pressure transmitting medium, the main housing is placed on the connector housing, and a prescribed pressure is applied to the sensor to dissolve air trapped in the pressure detecting chamber during the previous step into the transmitting medium and to purge the rest through the high polymer compound materials used in the connector housing. As a result, a non-linear pressure rise in the pressure detecting chamber can be prevented.