The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 1997
Filed:
Jul. 24, 1995
Applicant:
Inventor:
Yoon S Kim, Seoul, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon, KR;
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437180 ; 437182 ; 437187 ; 437188 ;
Abstract
A method for forming a protective oxide film on the bonding pads of a semiconductor chip which is to be encapsulated by a molded-in-place capsule of plastic material including exposing a chip having bonding pads (while the chip is in the form of wafer), to O.sub.3 and ultraviolet (UV) radiation, so that excited oxygen generated from the O.sub.3 by UV radiation oxidizes metal atoms, for example aluminum atom of the aluminum bonding pads, to form a fine oxide film over the bonding pads, this film providing protection from water and/or ions which would otherwise cause corrosion of the bonding pads.