The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 1997
Filed:
Jun. 07, 1995
Kim L Walton, Lake Jackson, TX (US);
Rajen M Patel, Lake Jackson, TX (US);
Pak-Wing S Chum, Lake Jackson, TX (US);
Todd J Obijeski, Houston, TX (US);
The Dow Chemical Company, Midland, MI (US);
Abstract
A method of manufacturing a monolayer heat-shrinkable, puncture-resistant biaxially oriented film is disclosed. The method includes a double bubble orientation step and extruding a primary tube that includes at least one substantially linear ethylene homopolymer or interpolymer, wherein the substantially linear ethylene homopolymer or interpolymer has an uniform branching distribution, a melt flow ratio I.sub.10 /I.sub.2, .gtoreq.5.63, and a molecular weight distribution, M.sub.w /M.sub.n, defined by the equation M.sub.w /M.sub.n .ltoreq.(I.sub.10 /I.sub.2)-4.63, and is also characterized as having essentially no linear polymer fraction, a single DSC melting peak, a density greater than about 0.85 g/cc, and a favorable gas extrusion critical shear rate at the onset of surface melt fracture.