The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 1997
Filed:
Dec. 27, 1994
Shigeru Fujita, Numazu, JP;
Hiroshi Okuyama, Numazu, JP;
Kazuhiro Tashiro, Numazu, JP;
Shogo Ishibashi, Numazu, JP;
Atsuhiro Suzuki, Fukushima, JP;
Motoyuki Hirata, Kawasaki, JP;
Toshiba machine Co., Ltd., Tokyo, JP;
Tohoku Munekata Co., Ltd., Fukushima, JP;
Showa Denko K.K., Tokyo, JP;
Abstract
A reference pressure of melted material injected to a mold cavity of a mold is set as a function of injection passing time from a start of an injecting process or a function of a distance of movement of an injection plunger, and the movement of the plunger is started at a temporarily constant injection speed. A correction value of the injection speed is obtained to eliminate a difference between a sensed pressure of the melted material injected to the mold cavity of the mold and the reference pressure in a range that the sensed pressure of the melted material exceeds the reference pressure during the injection passing time from the start of the injection process wherein the plunger is started to move or during the movement of the plunger, and the injection speed is corrected in accordance with the corrected value. The corrected value of the injection speed, and the injection passing time from the start of the injection process or the distance of the movement of the plunger, those of which corresponding to the range, are memorized in a memory unit, and are characterized to a desired injection speed pattern, and the pattern is read out from the memory unit as an injection molding speed condition.