The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 1997
Filed:
Jul. 11, 1995
Robert G Henderson, Wickliffe, OH (US);
James W Kristoff, Lyndhurst, OH (US);
David A Molyneaux, Mentor, OH (US);
Picker International, Inc., Highland Heights, OH (US);
Abstract
A resonance exciting coil (C) disposed in an image region in which a main magnetic field and transverse gradients have been produced. A flexible receiving coil (D) includes a flexible plastic sheet (40) on which an electrically continuous flexible foil strip (36) is adhered to receive signals from the resonating nuclei. The coil also includes components (24), mounted on the flexible plastic sheet (40), which may amplify the received signals before they are transmitted along a cable (22). A first soft material layer (44) is mounted on the flexible plastic sheet (40) for providing comfort to the patient. A flexible mechanical structure (50) on which two flexible receiving coils (F, G) adjusts an overlap between the coils (F, G) as the coils are flexed to adjust interaction properties of the coils (FIGS. 4 A, 4B). Pivotal rods (56) of a fixed length which connect two flexible coils (F, G) cause the spacing of the coils to vary in accordance to a flex applied to the coils to adjust the relative interactive properties with flexing (FIGS. 5 A, 5B). Flexible coils (D) in modular components provide identification points on each modular component which connect to similar identification points on other flexible coil modular components (FIGS. 9 A-9C).