The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 1997
Filed:
Apr. 20, 1995
Tomoyuki Uchiyama, Tokyo, JP;
Nippon Steel Corporation, Tokyo, JP;
Abstract
A semiconductor device includes an inter-level insulating film formed on a semiconductor substrate. Wiring layers are formed at different depths inside the interlevel insulating film. Open aperture portions have different depths and are formed in the inter-level insulating film so as to reach each of the wiring layers. A titanium nitride film (first conductor layer) is formed on the inner surface of each of the open aperture portions and on the inter-level insulating film. A silicon oxide film (insulating film) is formed on the titanium nitride film and hardly on the inner surface of each of the open aperture portions. A tungsten film (second conductor layer) is formed inside each of the open aperture portions. An aluminum wiring (third conductor layer) is formed on the tungsten film.