The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 1997

Filed:

Jul. 29, 1994
Applicant:
Inventors:

Michael Greenstein, Los Altos, CA (US);

Henry Yoshida, San Jose, CA (US);

Assignee:

Hewlett-Packard Company, Palo Alto, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R / ; H04R / ; H01L / ;
U.S. Cl.
CPC ...
29594 ; 29 2535 ; 29827 ; 310327 ; 310334 ;
Abstract

A Z-axis backing layer for an acoustic transducer is provided, which comprises a matrix of electrical conductors disposed in parallel and potted within an electrically insulating acoustic backing material. The acoustic transducers are disposed on a first end of the backing layer, with each individual transducer element connecting electrically to a respective one of the conductors. At the other end of the backing layer, the conductors connect electrically to a corresponding circuit element. The backing layer is fabricated from a plurality of leadframes each having an outer frame member and a plurality of conductors extending in parallel across the leadframes terminating at the frame members at opposite ends thereof. The plurality of leadframes are stacked such that respective conductors of adjacent ones of the leadframes are disposed in parallel with a space provided between the respective conductors equivalent to a width of one of the leadframes. Acoustic backing material is poured onto the stacked plurality of leadframes to completely fill the spaces between conductors. The frame members and excess acoustic backing material are then removed from the stacked and poured plurality of leadframes.


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