The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 1997
Filed:
Sep. 29, 1993
Takayuki Atarashi, Tsuchiura, JP;
Toshio Hatada, Tsuchiura, JP;
Takahiro Daikoku, Isehara, JP;
Nobuo Kawasaki, Ibaraki-ken, JP;
Toshiki Iino, Ibaraki-ken, JP;
Tamotsu Tsukaguchi, Hiratsuka, JP;
Kenichi Kasai, Hadano, JP;
Fumiyuki Kobayashi, Sagamihara, JP;
Yoshito Hayashi, Hadano, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
An electronic apparatus having a plurality of semiconductor devices which produce heat during operation, with a heat sink having a plurality of tabular or pin-type fins is provided on each semiconductor device. Nozzles are associated with the heat sinks so as to supply a cooling fluid into the heat sinks. The heat sinks are so arranged that all these heat sinks guide and discharge the cooling fluid in the same direction. A breadth of the respective nozzles, as measured in the direction (x-direction) of the flow and discharge of the cooling fluid determined by the heat sink is less than that of the associated heat sink. A width of the nozzle, as measured in the direction (y-direction) perpendicular to the x-direction is smaller than that of the associated heat sink. A space between adjacent nozzles provide a discharge passage of an ample cross-section which reduces resistance encountered by the heated cooling medium to be discharged therethrough.