The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 1997
Filed:
Dec. 05, 1994
Minh-Hien N Clark, Austin, TX (US);
James W Sloan, Austin, TX (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
Pad array carriers allow greater I/O densities over conventional leaded packages by using an array arrangement for external electrical connections. A pad array carrier (48) is manufactured using a substrate (40) having metal on only one side and unplated through-holes (44). A semiconductor die (50) is mounted on and affixed to the top surface of the substrate with an electrically insulative adhesive (51). The use of the insulative adhesive allows routing of signal traces into the die mounting region directly underneath the die. Wire bonds (52) connect the die to metal traces (46) on the substrate. A package body (54) is formed on the substrate covering the die and wire bonds (52). Solder balls (56 & 58) are directly attached to the backside of the solder pads (47) by way of the through-holes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile