The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 1996
Filed:
Apr. 28, 1995
Applicant:
Inventor:
Ira E Baskett, Tempe, AZ (US);
Assignee:
Motorola, Inc., Schaumburg, IL (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257419 ; 257414 ; 257415 ; 257417 ; 257418 ;
Abstract
An edge die bond semiconductor package including a semiconductor die having an active major surface and a mounting edge substantially orthogonal to the active surface, a base having a mounting surface, and material affixing the mounting edge of the semiconductor die to the mounting surface of the base.