Multi-metal layer wiring tab tape carrier and process for fabricating

Abstract

A multi-metal layer wiring TAB tape carrier capable of forming a fine pattern without affecting the thicknesses of conductive metal layers, and a process for fabricating the multi-metal layer wiring TAB tape carrier. This TAB tape carrier is constructed such that respective dielectric film layers are interposed between adjacent ones of plurality of conductive metal layers having a predetermined wiring pattern, such that the dielectric film layer is formed with interfacial connection holes, and such that a conductive via layer is formed in the interfacial connection holes to electrically connect adjacent conductive metal layers. The conductive via layer is formed by a vapor deposition method such as evaporation, ion plating or sputtering. Alternatively, a portion of the conductive metal layers and the conductive via layer are simultaneously formed. Especially according to the latter method of forming a portion of the conductive metal layers and the conductive via layer simultaneously, the conductive via layer need not be formed after the conductive metal layers so that the fabrication steps are simplified. Moreover, the thicknesses of the conductive metal layers are not adversely affected later, and the conductive metal layers and the conductive via layer can be positioned highly precisely to form a fine wiring pattern.