The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 1996

Filed:

Jun. 06, 1995
Applicant:
Inventors:

Ryuji Sawaoka, Ehime, JP;

Shinji Kouchi, Matsuyama, JP;

Toshio Muraki, Matsuyama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08K / ;
U.S. Cl.
CPC ...
523211 ; 523205 ; 523440 ; 4272133 ; 42721336 ; 525423 ; 525523 ; 525528 ; 525936 ;
Abstract

Disclosed is a microcapsule curing agent including (A) a curing agent for a thermosetting resin and (B) a thermoplastic resin. The microcapsule curing agent is formed as a particle-like material in which component (A) is coated with a layer whose main constituent is component (B) and the mean particle diameter of which is in the range of 0.1 to 20 .mu.m. By using the microcapsule curing agent, a thermosetting resin composition and a prepreg which exhibit good storage stability at room temperature and are excellent in thermal resistance for cured products made therefrom can be obtained. A fiber reinforced composite material obtained using the thermosetting resin composition is excellent in curing uniformity and thermal resistance.


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