The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 1996
Filed:
May. 26, 1995
Satoshi Takeuchi, Tokyo-to, JP;
Abstract
The present invention provides a process for preparing a printing plate, comprising the steps of: providing an N-type photoconductor layer having an optical memory property on the surface of a substrate having an electrical conductivity at least in its surface to form an N-type photoconductor substrate; subjecting the N-type photoconductor layer to a desired pattern-wise exposure by batch exposure and/or photo-drawing exposure to render exposed areas electrically conductive; immersing the N-type photoconductor substrate in an electrodeposition bath to electrodeposit an ionic organic polymer contained in the electrodeposition bath to form an electrodeposit layer; and washing and drying the electrodeposited substrate to prepare a printing plate. Further, the present invention provides a process for preparing a printing plate, comprising the steps of: subjecting an N-type photoconductor layer provided on an N-type photoconductor substrate to a desired pattern exposure by batch exposure and/or photo-drawing exposure to render exposed areas electrically conductive; electrodepositing an ink-receptive component on the exposed areas; and transferring the ink-receptive component onto a substrate for a printing plate to prepare a printing plate having an ink-receptive area. Furthermore, the present invention provides a process for preparing a printing plate, comprising the steps of: exposing the whole surface or a necessary region of an N-type photoconductor layer provided on an N-type photoconductor substrate, thereby rendering exposed areas electrically conductive; heating the exposed areas by hot pattern drawing to erase the conductivity of the heated areas; and electrodepositing an electrodeposition material on the remaining conductive areas to form an electrodeposit layer.