The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 1996
Filed:
Dec. 17, 1993
Applicant:
Inventor:
Young-Kwon Jun, Seoul, KR;
Assignee:
Goldstar Electron Co., Ltd., Chungcheongbuk-do, KR;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437 41 ; 437190 ;
Abstract
A method for forming a contact hole for a metal line in a semiconductor device, including the steps of forming a contact area on a semiconductor substrate to be connected to a metal line, forming a groove, of which side is insulated from a contact portion on a bottom and at a side of the groove, forming an insulating layer on a whole surface of the semiconductor substrate, and forming a contact hole by removing a portion of the insulating layer on the barrier metal contact portion.