The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 1996
Filed:
Feb. 23, 1995
Masaru Kanaoka, Aichi, JP;
Homare Mori, Aichi, JP;
Takayuki Yuyama, Aichi, JP;
Shozui Takeno, Hyogo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A laser cutting method with which cutting faults at the time of cutting condition changing are substantially eliminated. Impingement of the laser beam on the workpiece is stopped when the laser beam reaches a position along the path where the first cutting conditions are to be changed to second cutting conditions. The laser beam is then retracted along the path a predetermined distance from the position where the first cutting conditions are to be switched to the second cutting conditions. After a delay time, the laser beam is again moved along the predetermined path to cut the workpiece under the second cutting conditions. The retraction distance is set in accordance with the thickness of the workpiece. Also, an assist gas may be sprayed on the workpiece in the vicinity of the cutting path while impingement of the beam is stopped.