The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 1996

Filed:

Dec. 08, 1994
Applicant:
Inventors:

Marcus Textor, Schaffhausen, CH;

Roman Fuchs, Neuhausen, CH;

Volkmar Gillich, Jestetten, DE;

Erich Simon, Singen, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D / ;
U.S. Cl.
CPC ...
427162 ; 427250 ; 4272557 ; 427295 ; 427405 ;
Abstract

A process for forming a reflective surface, comprises the steps of: providing at least a part of at least one unanodized surface which has a peak-to-valley height Ra of equal to or less than 1 micron. The unanodized surface is selected from the group consisting of (1) refined aluminum with a degree of purity equal to or greater than 98.3% by weight aluminum and (2) aluminum alloys with at least one element selected from the group consisting of Si, Mg, Mn, Cu, Zn, Fe. The unanodized surface is in a form selected from the group consisting of rolled foil, rolled sheets, and rolled strips and said unanodized surface is used as a substrate. The process further includes depositing at least two layers from the gas phase on the unanodized surface, wherein the two layers include a ceramic adhesive layer from the gas phase and at least one reflecting layer from the gas phase on said adhesive layer for the reflection of radiation with wavelengths in the optical range. The reflecting layer is selected from the group consisting of aluminum, silver, gold, copper and alloys containing at least one of aluminum, silver, gold and copper.


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