The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 1996
Filed:
Aug. 15, 1994
Frank Reiss, Lauchringen, DE;
Stefan Tschirren, Thalheim, CH;
ABB Management AG, Baden, CH;
Abstract
In a method for cooling a thermally loaded component (1) with a plate-type outer wall (2), in which method cooling air is supplied, in a first cooling section (A) of the component (1), through a cooling air supply (5) in the direction towards the outer wall (2) and is deflected laterally before the outer wall (2) and in a second cooling section (B) is further guided parallel to the outer wall (2) in a laterally adjoining cooling air duct (3) for the purpose of further cooling, homogenization of the cooling is achieved wherein, in order to reduce the impingement cooling in the first cooling section (A), the cooling airflow coming from the cooling airsupply (5) is subdivided into a main flow and a by-pass flow, the main flow is guided directly along the outer wall (2) of the component (1) to the cooling air duct (3), the by-pass flow is guided to the cooling air duct (3) without contacting the outer wall (2) and both partial flows are recombined at the inlet to the cooling air duct (3).