The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 1996

Filed:

Jan. 11, 1995
Applicant:
Inventors:

Warren D White, Lake Jackson, TX (US);

Muhammad A Shafi, Lake Jackson, TX (US);

L James Lee, Dublin, OH (US);

Kerang Han, Columbus, OH (US);

Assignee:

The Dow Chemical Co., Midland, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F / ; G06G / ; G06G / ;
U.S. Cl.
CPC ...
36447509 ;
Abstract

A system and method for simulating LCM mold filling utilizes at least one processor, suitable RAM and storage memory, input means, display means, and logic for simulating the injection of resin into a mold cavity containing a preform based upon mold cavity design parameters, mold filling processing parameters, physical property parameters, and system processing parameters, and identifying the current state of selected mold filling conditions at selected points in time during the simulated mold filling process. The system includes logic for identifying incipient dry spots, and also preferably includes means for interrupting the operation of the program at selected points to vary selected parameters to eliminate incipient dry spots and otherwise maximize the mold filling process. The system may additionally include logic for determining whether the output from a mold filling simulation satisfies a set of predefined criteria to determine whether a particular mold design and/or filling process is acceptable for use in production and, if so, record the approved mold filling process parameters for transfer and input to an RTM mold control. Alternatively, the system may be incorporated into a conventional mold control for direct input of developed mold filling process parameters into the control for use in operating the mold to produce liquid composite plastic parts.


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