The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 1996

Filed:

Jun. 06, 1995
Applicant:
Inventor:

Christopher G Morosas, Sutton, MA (US);

Assignee:

Wakefield Engineering, Inc., Wakefield, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361704 ; 165 802 ; 165 803 ; 165185 ; 174 163 ; 248505 ; 248510 ; 257719 ; 267150 ; 267160 ; 361710 ; 361715 ;
Abstract

A spring clip for clamping a heat sink module to an electronic module which has a pair of opposite side edge surfaces and a pair of spaced projections which extend from each side edge surface. The spring clip includes an elongated generally horizontal middle segment, a pair of end segments at opposite ends of the middle segment which extend in a first direction at an upward angle and a finger tab segment which is connected to the middle segment and which extends at an upward angle in a second direction which is opposite the first direction. A spring clip and heat sink assembly is formed by attaching a pair of spring clips to opposite ends of the heat sink for application to an electronic module. A heat dissipating assembly is formed by applying the spring clip and heat sink assembly to an electronic module which has a pair of projections extending from opposite edge surfaces of the electronic module. The horizontal middle segment of the spring clip can be moved from an inactive state above a respected pair of projections to an active state beneath the projections so that the middle segment is biased upwardly against the projections for clamping the heat sink to the electronic component.


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