The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 1996
Filed:
Jun. 30, 1995
Kimiaki Tanaka, Kanagawa, JP;
Kouhei Eguchi, Kanagawa, JP;
Nippon Steel Corporation, Tokyo, JP;
Abstract
An interconnection pattern of a Cr film is defined by a wet-etching process by using fluoric acid and then a Cu film is grown over the surface of the Cr film. It is therefore not necessary to use a chloride gas when defining an interconnection pattern of a Cr film and when forming a Cu film. As a consequence, CuCl.sub.2, which is a chloride, will not remain after the fabrication of an interconnection and corrosion of Cu and Cr films owing to the attachment of hydrochloric acid resulting from the reaction between a chloride and water. The present invention therefore can provide highly reliable and dependable interconnection structures for semiconductor devices and a method for fabrication thereof. The growth of Al on Cr is also shown.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile