The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 1996
Filed:
Oct. 11, 1994
Applicant:
Inventors:
Jay D Baker, Dearborn, MI (US);
Cuong V Pham, Northville, MI (US);
Robert E Belke, Jr, West Bloomfield, MI (US);
Assignee:
Ford Motor Company, Dearborn, MI (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ; H05K / ; H01L / ;
U.S. Cl.
CPC ...
29840 ; 29841 ; 174259 ; 22818022 ; 228254 ; 437211 ;
Abstract
` Method for fabricating an undercoated chip electrically interconnected to a substrate. The method includes the initial step of depositing a predetermined quantity of a liquid undercoat material onto the chip or the substrate. The method continues with the step of interconnecting the chip to the substrate so as to form an electrical interconnection bond therebetween. Finally, the method concludes with the step of heating, reflowing and curing the undercoat material during or after the step of electrically interconnecting the chip to the substrate.