The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 1996
Filed:
Sep. 15, 1994
David H Devonald, III, Green Oaks, IL (US);
Leonard V Chabala, Maywood, IL (US);
Albert F Cowsky, Elk Grove Village, IL (US);
Michael P O'Dell, Oak Park, IL (US);
Other;
Abstract
An interconnection arrangement is provided for the appropriate interconnection of predetermined assemblies and modules affixed to the exterior of an enclosure of pad-mounted gear, while also shielding the interconnections from the medium-voltage sections of the pad-mounted gear. The interconnection arrangement may be utilized either during manufacture of the pad-mounted gear or as a field retrofit installation. The interconnection arrangement includes a base assembly which defines predetermined enclosed cable pathways through which the interconnecting conductors are routed. The interconnecting conductors are provided by preassembled and pre-routed cable harnesses within the defined cable pathways. The interconnection arrangement also includes internal and external duct structures that extend the cable pathways through the base assembly and into the individual enclosures for the assemblies and modules affixed to the exterior of the enclosure of the pad-mounted gear. The interconnection arrangement is of modular design so as to be easily configurable for installation to different configurations of pad-mounted gear and affixed assemblies. In addition to the interconnection arrangement being versatile, it also lends itself to ease of manufacture and the use of basic component parts to provide different configurations as either manufacturing assemblies or field retrofit kits.