Method of mounting a lens on a light emitting diode

Abstract

A rear surface emission type light emitting diode emits light beams produced at a narrow emanating region out of the rear surface of the substrate. Preferably a device chip should be directly equipped with a lens on the rear surface. A plurality of light emitting devices with a package are laid on an XY-stage which can move in an XY-plane. A camera, a dispenser and a vacuum collet can transfer in Z-direction. The distances and the directions among the camera, the dispenser and the collet are predetermined values. The chip is actually examined by letting it emit light beams from the emanating region. The light is observed by the camera to obtain light power distribution on individual pixels. From the light power, the center of the emanating region is determined. The XY-stage is displaced till the center of the emanating region coincides with the center of the camera. Then the XY-stage is moved by the predetermined distance to send the chip just beneath the dispenser. The dispenser comes into contact with the chip and supplies ultraviolet resin to the chip. The XY-stage is again displaced by the predetermined distance to feed the chip below the vacuum collet holding a lens. The collet brings the lens in the resin on the surface till the lens touches the surface. Ultraviolet rays are cast on the ultraviolet hardening resin to stiffen the resin.