The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 1996
Filed:
Dec. 02, 1994
Applicant:
Inventors:
Norio Narazaki, Hiratsuka, JP;
Yoshihiro Kayano, Hiratsuka, JP;
Yuko Itagaki, Hiratsuka, JP;
Ryoji Ukaji, Isehara, JP;
Assignees:
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Ichikoh Industries, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D / ; B29D / ;
U.S. Cl.
CPC ...
428131 ; 428167 ; 428156 ; 428338 ; 428220 ; 428119 ; 428122 ; 248300 ; 2484751 ; 359844 ; 359871 ; 264237 ; 26432814 ; 264348 ;
Abstract
A molded article is formed of a thermoplastic or thermosetting resin and has two planes joining each other in a junction portion; at least one of the two planes has an opening portion or a thin wall portion in the vicinity of the junction portion in order to decrease warpage of the molded article.