The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 1996
Filed:
Apr. 21, 1995
Joerg Kickelhain, Neustadt, DE;
LPKF CAD/CAM Systeme GmbH, Garbsen, DE;
Abstract
A method for patterned metallization of the surface of substrates (1), particularly circuit boards, using electromagnetic radiation (5) in which an electrically nonconducting prime coat (2) is applied full-surface to the substrate (circuit board 1); an electrically nonconducting cover coat which is easily ablated by electromagnetic irradiation (5) in the ultraviolet range is applied full-surface to the prime coating (2), the cover coat (4) being applied in a thickness that is at least equal to the thickness of the metal layer that is to be applied; the cover coat is removed from partial areas by the action of electromagnetic irradiation (5) in the ultraviolet range to form patterns (6) with sharp and steep flanks (7) and expose the prime coat (2); and in the area of the exposed patterns (6) on the prime coat (2), a metal layer is applied, guided by the flanks (7), in a reducing bath. The method facilitates patterned metallization with a very high resolution on the surface of substrates, without the need for an etching procedure.