The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 1996
Filed:
Oct. 11, 1994
Homayoun Talieh, San Jose, CA (US);
David E Weldon, Los Gatos, CA (US);
Ontrak Systems, Inc., Milpitas, CA (US);
Abstract
A polishing pad cluster for polishing a semiconductor wafer having multiple integrated circuit dies includes a pad support and multiple polishing pads. Each pad has a polishing area substantially smaller than the wafer but not substantially smaller than an individual one of the integrated circuit dies. Each polishing pad is mounted to a respective polishing pad mount, which is in turn supported by the support. Each mount includes a respective joint having at least two degrees of freedom to allow the associated polishing pad to articulate with respect to the support to conform to the wafer. Each mount is substantially rigid in a direction perpendicular to the pad toward the pad support, and in some cases the adjacent mounts are completely isolated from one another. A magnet is used to bias the polishing pad against the wafer.