The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 1996

Filed:

Feb. 03, 1994
Applicant:
Inventors:

Yasuo Sugiura, Shizuoka, JP;

Hiroshi Seo, Shizuoka, JP;

Seiji Saikawa, Shizuoka, JP;

Assignee:

Asahi Tec Corporation, Shizuoka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22D / ; B22D / ; B22C / ;
U.S. Cl.
CPC ...
164120 ; 164312 ; 164900 ;
Abstract

The present invention is to provide a semi-molten metal molding apparatus with a die including a die hole and a cavity, and a punch movable into the die hole, in which the die hole is opened downwardly, and the punch is set below the die hole in such a manner that it is movable into the die hole. According to the present invention, the cavity is filled with a part of the material which has no oxide film or has an oxide film smaller in thickness.


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