The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 1996

Filed:

May. 15, 1995
Applicant:
Inventor:

Kenichi Oi, Osaka, JP;

Assignee:

Tabai Espec Corp., Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R / ;
U.S. Cl.
CPC ...
324760 ;
Abstract

An apparatus for burn-in of semiconductor devices has board assemblies including a burn-in board and a driver board. The burn-in board has sockets on a first surface for accepting the semiconductor devices and first terminals extending from the sockets to protrude from a first back side of the burn-in board. The driver board has a second surface carrying an electronic circuit to drive the semiconductor devices and a second back side with second terminals for connecting the electronic circuit to the first terminals. The driver board has an edge connector with terminals for applying power to the electronic circuit. The burn-in board and the driver board are disposed with the first and second back sides facing such that corresponding ones of the first and second terminal can be brought into and out of contact with each other. The board assemblies are supported in a housing wherein the board assemblies form partitions isolating first and second environmental spaces for burn-in and cooling operation. A flexible seal is provided between the burn-in board and the driver board to permit said first and second terminals to be brought into contact with each other by pneumatic operation.


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