The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 1996

Filed:

Feb. 02, 1995
Applicant:
Inventors:

Takashi Saito, Kanagawa, JP;

Shigeo Ikeda, Kanagawa, JP;

Masumi Okutsu, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R / ; G01R / ;
U.S. Cl.
CPC ...
324755 ; 439 71 ;
Abstract

An IC measuring and testing device and measuring and testing method comprising a measurement handler socket provided with mold-receiving base having guiding members corresponding to the shape of a mold body of an IC to be tested around its periphery and probes for contacting outer leads of the IC, and a suction arm for suction-supporting the IC and transferring it to the mold-receiving base, the IC measuring and testing device performing measuring and testing on the IC mounted in the mold-receiving base by means of the suction arm, the guide members corresponding to and separated from the outer leads of the IC, and terminal portions of the probes being arranged inserted into these separation portions. As a result, when the IC is set, the guide members and the like of the socket can be prevented from striking against the outer leads of the IC and deforming them.


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